Fine Line Capability
- 2 mil line / 2 mil space
- Compact routing
- Application-driven DFM
FLEXIBLE PCB & RIGID-FLEX SOLUTIONS
High-performance flex PCB and rigid-flex solutions engineered for complex applications and demanding environments.

Streamlined flex interconnects for space-constrained electronic designs.
More routing capability in a thin, flexible circuit construction.
Higher circuit density for complex interconnect and packaging requirements.
Combines rigid PCB sections and flexible interconnects in one integrated design.
Bend and fit into compact enclosures.
Potentially replace heavier discrete wiring.
Consolidate connection points and routing.
Route through three-dimensional product geometry.
Fewer separate wires, connectors and subcomponents.
Design materials and construction around the application.

From design support through value-added assembly, Printec can support the flexible circuit and the components surrounding it.
DFM review, manufacturing input and stack-up optimization.
Component population for flex and related electronic assemblies.
Support for mixed flexible and conventional PCB constructions.
Integrate FPCs with HMI components and larger electronic subassemblies.






Custom circuit constructions for compact and complex designs.
DFM and Gerber/CAM support to move designs toward production.
Support beyond the bare flexible circuit.
Combine FPCs with membrane switches, keypads, touch interfaces and overlays.
ISO 9001, ISO 13485, ISO 14001 and IATF 16949 quality systems.
Manufacturing scale backed by responsive customer and engineering support.
Material selection depends on electrical, mechanical, environmental and assembly requirements. Printec can review the intended application during DFM.
Yes. Printec supports rigid-flex constructions that combine rigid PCB areas and flexible interconnect zones.
Printec publishes a fine-line capability down to 2 mil / 2 mil, subject to design review and manufacturing requirements.
Gerber/CAM data and supporting drawings are typically used to evaluate a flexible circuit program. Include stack-up, dimensional and assembly requirements when available.
Printec supports multilayer flexible circuit constructions up to 8 layers, depending on the application and design.
Yes. Printec can support SMT population, FPC-to-PCB integration and value-added HMI or electronic assembly.
Send us your Gerber files, drawings, stack-up requirements, estimated annual volume, and assembly requirements.